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1551 S. Harris Court, Anaheim, CA 92806
Phone: 714.978.1551 Fax: 714.978.0431
Specifications: Model 2400B Automatic Wire Bonder Series Last revised: 4/18/2003
Overview
WEST · BOND Model 2400B is an ultrasonic wedge-wedge wire bonder designed to interconnect wire leads to semi-conductor, hybrid, or microwave devices. The machine bonds aluminum or gold wires ranging from 0.0007 in. to 0.002 in. Bonds are by the wedge-wedge technique using ultrasonic energy to attach aluminum wire at room temperature and adding work piece heat for gold wire. Wire is clamped and threaded diagonally under the bonding wedge, allowing independent feeding action but requiring front-to-back bonding direction. The machine will accept complex programs of device coordinate and bond data and then proceed to measure position corrections and to bond an array of connections automatically without operator intervention.
Mechanical
Bonding tool and camera focus are driven along vertical ways by stepper motors through linear actuator and bell crank mechanisms that prevent damage from motor over travel for any reason. The work station moves on opposed ball bearings along horizontal ways driven by stepper motors through lead screws. An extra transfer way allows both drive motors to remain stationary to minimize moving inertia. Two additional motor and actuators couple through bearings to the bond head to drive the wire clamp position and the force spring preset. All motors are driven in micro-step mode, but with sufficient resolution to stop on half-step boundaries.
A rotary workstation is mounted on and moves with the X-Y table. The work piece on this station can be clamped mechanically or held by vacuum, and (in Model No. 2416B) can be heated up to 200 ° C controlled by West·Bond Model 1200D Temperature Controller. Adapters for different work pieces can be exchanged readily.
Ranges, Ratios and Resolutions
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Bond "Y" |
Range |
4.250 inches |
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Resolution |
0.00025 inch per half-step |
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Bond "X" |
Range |
5.250 inches (including offset) |
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|
Resolution |
0.00025 inch per half-step |
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Bond "Z" |
Range |
0.500 inch |
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Resolution |
0.0005 inch per half-step |
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Offset "Y" |
Distance |
0.3125 inches, making useable "Y" range, 3.9375 inches |
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Rotation |
Range |
Unlimited |
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Resolution |
0.25 Degree – only affects wire placement direction |
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Force |
Range |
20 to 175 Grams – programmable each bond |
Electrical
Computer CPU is Pentium II with 64 MB memory housed in an industrial card cage with PCI backplane and with 6.4 GB IDE hard disk storage. User data can be written in compressed format to and from Iomega 100 MB Zip disks. Programmed motions are calculated to accelerate acceleration, called "S Curve", and are executed through Galil Model DMC-1070-NA seven axis motion control. Motor phases are switched through IMS Models IM-1007 and IM-483 microstepping drivers. Matrox video frame grabber working together with Cognex Model 5200 pattern recognition system formats visual data. Monitor is Samsung TFT 15 in. flat panel color display, or equivalent. The vertical TV camera focus elevations are programmable. An external view TV camera to provide a side view of the bonding operation is also included. The view shown on the monitor is switched automatically between the alignment and the bonding views at appropriate times during the machine cycle.
The ultrasonic transducer is K~Sine Model 24-W, one half wave in length, operating at a nominal frequency of 63 KHZ. Built in ultrasonic power supply is K~Sine Part No 6795, four Watts. Settings of power and time program values are executed via an eight-bit interface. Radiant tool heat with panel mounted, constant current control is included.
Preparation of a new end of the wire stock and the threading of that end into the feed hole of a 45 ° bond tool can be done automatically by machine motions following a simple location of the wire relative to the tool. The method is patented and requires use of special bond tools.
Software
Operator interface for data entry and edit and for all machine operation is a West·Bond software application running under Windows. Information is presented graphically via numerous forms designed specifically for each task. Operation is consistent with other applications running under Windows. A view of the work piece is presented in a window within the application window: Control of machine motions to measure coordinates and corrections is by standard Microsoft Mouse. Control of bonding execution is either by Mouse selection of form controls on screen, or optionally by a few dedicated switches. A complete context sensitive, hyper-text Help file is available at every event.
User data is organized in a Microsoft Access Database that is a part of the West·Bond application. This data is presented for view on forms specific to each task of entering, editing, and bonding, and optionally in its native tables where it can be manipulated by database methods. This data is stored, even for machine use, as an Access file with ".mdb" extension. These files include all data necessary to each customer device; including the pattern recognition binary data of the view of each chip align point and any bond targets. Several of these files can be stored on the hard drive and selected for use as desired. They can also be written for backup to Zip disks: Compression is automatic, both writing and reading. If customers have Microsoft Access available, they can view and print their data, hopefully without making illegal changes.
The design of the database and the application implements several concepts which make this machine especially useful for bonding high frequency, high power devices; such as, the definition of wires by "types" and the enforcement of "parallel" types. When not needed for other devices, these features can be ignored. In addition, there are included the repetition of blocks of coordinates as "copies", and optional provision to align individual bonds by pattern recognition for targeting very critical bonds after rotation more exactly than just correcting their chip align points.
ESD Protection
Protection against Electrostatic Discharge is implemented by finishing exposed tool assemblies and other moving parts by Electro less Nickel plating, which is conductive; and all exposed painted parts with a powder-coated paint that is dissipative.
Definitions of Models of this Series:
- Model No. 2400B. This machine without work piece heat and temperature controller.
- Model No. 2416B. This machine as described with work piece heat.
- Model No. 2600B. This machine with single tool assembly for Deep Access wire feed, Assy No. 6748.
- Model No. 2616B. This machine with single tool assembly for Deep Access wire feed, Assy No. 6748, and with work piece heat.
- Model No. 2426B. This machine with two tool assemblies, convertible to perform both 45
° wire feed with Assy No. 7295 and Deep Access wire feed with Assy No. 6748.
Model No. 242627B. This machine with three tool assemblies, all convertible; with Assy No. 7295 for 45° feed, Assy No. 6748 for Deep Access, and Assy No.6920 for Ball Bonding.
Model No. 2700B. This machine with single tool assembly for Ball Bonding, Assy No. 6920, and with circuitry installed for Electronic Flame-Off.
Features available for this Series:
- None. Old Feature –73B,Light Tower, Assembly No. 8023, is now standard.
Accessories
A Navitar Model No. 150 fiber optic ring illuminator, together with a beam splitter illuminator are provided for the vertical TV camera, and each is controlled for the needs of pattern recognition. K~Sine Automatic Wire Despooler is included. Bonding tools are not included. The microscope recommended for this model, but not included, is Olympus Stereo Zoom Model SZ3060E, ESD protected.
Services
Electrical service required is 115 VAC, 50-60 Hz, 7 Amps. For 200-240 VAC, an external step-down transformer is required and must be secured by end-user. Air pressure at 50 psig and shop vacuum are required to operate the machine. Machine size is 28" deep x 38" wide x 48" high, exclusive of microscope. Weight is 545 lb. uncrated, or 645 lb. crated.
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