This series includes: 2400B, 2600B, and 2700B. (Version 3.00 or later.)

Top Frequently Asked Questions:

  1. How to add new wire to the device ?
  2. How to add new chip to the device ?
  3. How to add new wire automatically ?
  4. How to change wire type properties ?
  5. How to copy wire type properties to other wire types ?
  6. What is the new fast bonding technique and how can I use it ?
  7. What else has been changed on the main screen ?
  8. What are other program modes or parameters available ?
  9. Can both versions (version 2.38 and 3.0) exist in the same system ?
  10. During bonding, I don't want the screen saver popup. Can I disable it ?



Question: How to add new wire to the device ?

Answer: You can add new wire to the device in several ways:

    • Add new wire when creating a new device with User Data Wizard.
    • Add new wire in Edit Wire Data option (from Main Menu, select Edit/Wire Data)
    • Add new wire in Edit Bond Coordinates option.

The system allows maximum of 1024 wires per user device.

 

Question: How to add new chip to the device ?

Answer: You can add new chip to the device in 2 ways:

    • Add new chip when creating a new device with User Data Wizard.
    • Add new chip in Edit Chip Data option (from Main Menu, select Edit/Chip Data)

The system allows maximum of 256 chips per user device.

 

Question: How to add new wire automatically ?

Answer: In the Edit Bond Coordinates option, click Add Wire button, it will show a dialog box to let you select which method and option to add new wire. To add wire automatically, select method #2 or #3. It will then guide you through steps to select the first wire or last wire coordinates depend on which option you have chosen. At each step, please read the "Status Prompt" for specific instruction what to do next. After you complete entering first wire coordinates (and last wire coordinates if you choose option #2), the program will generate bond coordinates for all wires in between.

 

Question: How to change wire type properties ?

Answer: From the Main Menu, select Edit/Wire Data. This option allows you to fully edit and maintain wire type data. Bond properties and wire type properties can be changed during bonding (in Search Pause mode or Inch Down mode). While paused, any of the bond shape parameters, -- Search, Loop, ZbeforeY, BackBend, etc. -- can be changed, and the results compared between this new wire and the previous one in view. These changes can be used only momentarily or can be saved permanently. The main screen only displays some common wire type properties. To change more wire type properties that do not show on the main screen, right-mouse click on Wire Type box will let you get into that Wire Type properties editing screen directly (you don't need to Run Home before doing it).

 

Question: How to copy wire type properties to other wire types ?

Answer: In Edit Wire Data, click the source Wire Type on the tree located at the left of edit windows, the corresponding wire type properties will show on the right side of windows. Change the bond or wire type properties as desire then click the button "Copy To Other Wire Type". You will be prompted to select which items you want to copy and the target wire types to copy to. You can copy to all wire types or selected wire types (using Browse and tag multiple selections).

 

Question: What is the new fast bonding technique and how can I use it ?

Answer: During bonding, the program will automatically look for the chip surface elevation at the first bond of each chip and after that it runs directly to the chip surface of remaining bonds (without running to Search and then slowly approach). In more technical term, the first bond will use firing switch sensor to detect the surface and disable the firing switch on the remaining bonds of the same chip. The result is that bonding time is faster by 40% or more. To enable this option, from the Main Menu, click on Run Direct To Surface (Fast Speed)? check box.

 

Question: What else has been changed on the main screen ?

Answer: Beside user can change wire type properties from the main screen, these are some additional changes or enhancements on the main screen:

    • Bond Path Position box -- This box shows the current bond path position: copy, wire, and bond number. When copy or wire data is changed during bonding, the work station will move (or rotate) to the real bonding position. If these data changed when the work station is rest at Home, only screen data is changed accordingly. Changing the bond data in this box only changes the corresponding wire type properties data for viewing or editing purpose, it never moves the work station.
    • The Previous and Next buttons have similar function as the Wire Up/Down buttons. Left mouse click on these buttons will move to previous or next wire. Right mouse click on these buttons will move to the first or last wire.
    • If you have a computer keyboard attached, the G key is simulated as the machine's Go switch.

XY table scroll is added with a third button. This button allows to move exactly 0.0005 inch each step (or one-half mil).

 

 

Question: What are other program modes or parameters available ?

Answer: The program normally resides in C:\WESTBOND directory.

    • To run the program in normal mode, the command should be C:\WESTBOND\M2000.EXE If you want the program run automatically upon start Windows, this program icon should be put in Windows Startup group or folder.
    • To run in PC simulation mode (for training purpose), use the switch /PC. E.g. C:\WESTBOND\M2000.EXE /PC
    • To restore factory machine configuration, use the switch /RECONFIG. E.g. C:\WESTBOND\M2000.EXE /RECONFIG. This option should be used only if the machine CONFIG.MDB file is corrupted and if user can not restore the CONFIG.MDB file from the backup floppy disk. Please backup CONFIG.MDB (machine configuration data) and device data frequently.

To start a default device when the program is loaded, use /DEV=xyz where xyz is the default startup device name. E.g. C:\WESTBOND\M2000.EXE /DEV=ABC

 

 

Question: Can both versions (version 2.38 and 3.0) exist in the same system ?

Answer: Yes, both software versions can exist in the same system, provided that you only use one program at a time. Although both programs can read device data interchangeably, but the alignment position can be different due to each program may find different home position. You can easily adjust this by realigning chip coordinates.

 

 

Question: During bonding, I don't want the screen saver popup. Can I disable it ?

Answer: The program live video window prevents the regular Windows screen saver from working properly. The West·Bond screen saver is specially designed to fix this problem: when the screen saver activates it will turn off the live video windows before activation. During bonding, if the screen saver pops up, it may interfere with pattern recognition (if the current device has one). To prevent this, you can disable the screen saver or modify the delay time longer via Control Panel similar to controlling regular Windows screen saver.


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